Espec offers a wide selection of Air to Air Thermal Shock Chambers with large capacity and high temperature to meet differing requirements.
The TSA series of Thermal Shock Chambers is designed to evaluate reliability of test specimens by rapid and repeated change of the air temperature from hot to cold, achieved by opening and closing of the damper in a single test area. Accurate test results are attained without any mechanical impact on test specimens because the test area does not move.
A fixed test area can save testing time because there is no transfer time of the specimen from one chamber to the other. These thermal shock chambers are suitable for testing large, heavy specimens and/or testing many small devices simultaneously.
The TSA-73EH-W is specially configured to meet the popular Mil-Std 883 1010 method which establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations.
Eco Operation Mode
An algorithm calculates the minimum operation time for pre-cooling and pre-heating by constantly measuring the amount of heat required for these processes. This feature reduces power consumption saving up to 50% over previous models.
Defrost-Free Test Chamber Operation (Option)
ESPEC has developed a unique structure that stops frost formation under low temperatures by preventing the penetration of external air (frost-free operation (patent 3514735)). Defrosting during cycle tests is now unnecessary. This can save significant test time (other chambers may need to defrost every 20-100 cycles), as well as saving additional energy.
1000 Cycles Continuous Operation (Option: Defrost-Free)
The Defrost-Free option enables 500 hours of continuous operation without interruption (if test conditions are set for 15 min. exposure).
Air To Air Thermal Shock Chamber Compatible With the ESPEC Evaluation System
ESPEC´s Conductor Resistance Evaluation System (sold separately) can continuously measure the minute resistance in solder joints and the conductive sections of connectors in low temperature and high temperature thermal cycle environments. It can be used for connection to the thermal shock chamber.
Highly Accurate Temperature Recovery
Dampers with an integrated rectifying function minimize variation in the conditions to which specimens are exposed due to their position within the test area.
Specimen Temperature Monitoring (Option)
Two temperature sensors are attached to the specimen in the test area to measure the specimen´s temperature. This option features a trigger function that switches to the exposure test after the two temperatures reach the temperature setting. This means that even more precise thermal tests can be run.