Designed for the AI and Autonomous Driving Era, Enabling Sample Temperature Linear Control at 20 K/min

Rapid-Rate Thermal Cycle ChamberTCC-151W-20

As AI and autonomous driving technologies advance, semiconductors are becoming more powerful and hotter than ever before. Increasing integration and density are driving higher heat generation, making temperature fluctuations a critical factor in device reliability and lifespan.

To meet these evolving challenges, we have developed the Rapid-Rate Thermal Cycle Chamber “TCC-151W-20.” Designed to deliver precise and highly reproducible temperature transitions, it enables reliable evaluation under demanding thermal conditions.

The TCC-151W-20 empowers engineers to accurately simulate real-world thermal stresses, accelerating development and ensuring the performance and durability of next-generation devices.

Application Example 1: Semiconductor Reliability Evaluation

During the development of highly integrated and high-density semiconductor devices, reliability evaluation is essential.

Challenges

• The device and substrate repeatedly expand and contract due to heat.
• Because the chip and the substrate have different thermal expansion rates, thermal strain is generated between them.
• This strain creates stress at the solder joints, which can lead to device failure.

Solution

Conducting reliability testing at the development stage is essential to ensure product performance and long-term durability. To address these issues, temperature cycle testing with precise and constant temperature change rates is required, often under conditions more severe than real operating environments.

Application Example 2: Reliability Testing for Servers: Reliability Evaluation for High-Capacity Servers

Challenges

As the processing power of high-capacity servers increases, heat generation also rises.

• This creates temperature fluctuations inside the equipment that exceed traditional ambient and climate-related conditions.
• Increased thermal load raises the risk of higher failure rates and shorter product lifespans.

Solution

Conducting reliability testing at the development stage is essential. To meet market expectations, temperature cycling tests must simulate conditions more severe than actual operating environments, such as ambient temperature and climate-related stress, while maintaining a constant temperature change rate. While 15 K/min or lower was previously the standard, increasingly harsh stress conditions are driving growing demand for testing at 20 K/min.

Not Just Faster – Optimal Temperature Linear Control for Market Needs

Excessively rapid temperature changes, such as those in thermal shock testing, may induce failure modes that differ from those encountered in real-world environments. Therefore, appropriate temperature gradient control is essential.

With the advancement of semiconductor technology, a temperature change rate of 20 K/min is considered an optimal level to replicate actual operating conditions.

Main Specification

Temp. Range	-70°C～+180°C
Temp. Changing Rate	20K/min　 *With 5 kg sample (glass epoxy substrate) + 4 kg jig installed
Test Area Volume	160 Liter
Inner Dimension Outer Dimention	W 800 x H 500 x D 400 (mm) W 1000 x H 1803 x D1913 (mm)

Key Advantages

• Ramp operation function enables precise sample temperature control at up to 20 K/min
• Achieves linear and highly reproducible temperature changes across a wide range from -70°C to +180°C

• Compatible with Various Test Standards
  • Supports JEDEC (semiconductor industry test standards)
  • Example: JESD22-A104 — up to 15 K/min (see figure below), as specified by the standard, while also supporting higher-speed testing at 20 K/min.
  • IPC (international standards for electronics and PCB quality and reliability)
  • Example: IPC-9701 — up to 20 K/min
  • IEC 60068-2-14 Nb (international standard for rapid temperature change testing of electronic components and equipment)
  • Previously limited to 15 K/min; revised in 2023 to include 20 K/min

• Ramp rate control ensures symmetrical strain waveforms during heating and cooling, maintaining a constant strain rate. This reduces variation in test results and improves reproducibility.

• Uniform temperature distribution enables testing of multiple samples under identical conditions, making it suitable not only for reliability evaluation but also for screening tests.
  • Temperature deviation: 1,5 K
  • Temperature gradient: 3,0 K

• Equipped with an easy setup mode that automatically calculates step time based on the specified temperature change rate

• Delivers stable and precise control during both temperature changes and steady-state operation, with enhanced performance over previous models